Tdev

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[[Image:1U Rear DS3 AC sml.jpg |thumb|250px|Rear view of Tdev TMP6400 with support for 3 DS3 connections ]]
 
[[Image:1U Rear DS3 AC sml.jpg |thumb|250px|Rear view of Tdev TMP6400 with support for 3 DS3 connections ]]
Tdev is the trade name for TelcoBridges' family of [[value-added services]] (VAS) development platforms.
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Tdev is the trade name for TelcoBridges' family of computer telephony and [[value-added services]] (VAS) development platforms.
  
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Tdev devices are targeted at service providers that are looking to introduce new value-added services in order to promote customer loyalty and/or increase ARPU. Applications developed with Tdev devices include [[unified communications]], [[ringback tones]], and [[Prepaid & postpaid calling|pre-paid/post-paid calling]] services, among many others.
  
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Tdev solutions are characterized by the requirement for an external application host, a key differentiator relative to the [[Tmedia]] family of products.
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== Individual products ==
 
The following products are part of the Tdev product line:
 
The following products are part of the Tdev product line:
  
*[[TMP6400]]: A high density VAS development platform featuring scalability to 64 E1/T1s, 3 DS3 or 1 STM-1 interfaces in a single device. 16 devices can be combined to form a single non-blocking system
 
*[[TMP800]]: A low density VAS development platform featuring support for up to 8 E1/T1s
 
*[[TMS1600]]: A purpose-built switch designed to connect up to 16 TMP6400 devices in a single non-blocking system
 
*[[TB640]]: TelcoBridges' VAS development platform based on CompactPCI blade hardware
 
  
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'''Rackmount'''
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*[[TMP800]]
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**Low density (8 full-duplex T1/E1/J1s) computer telephony platform; targeted to cost-effectively trial new value-added services
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*[[TMP5900]]
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**High density (64 full-duplex T1/E1/J1s, 3 DS-3, 1 STM-1) computer telephony platform with high performance onboard application host; available in 2U only; aimed at deploying new value-added services at the network core while simplifying OAM&P
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*[[TMP6400]]
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**High density (64 full-duplex T1/E1/J1s, 3 DS-3, 1 STM-1) computer telephony platform; available in 1U or 2U; providing a foundation for rapid subscriber uptake for new value-added services at larger points-of-presence (POP)
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*[[TMP7900]]
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**Very high capacity, high-availability computer telephony platform cluster; available configuration of up to 16 TMP-6400 units per rack for a total of 32,768 ports using a mix of E1/DS-3/STM-1 interfaces; aimed squarely at the network core, including large-scale value-added services or projects that involve device replacement and consolidation
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*[[TMP7950]]
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**1U form factor TelcoBridges-branded server appliance featuring quad-core Intel Xeon processors and 2x500GB RAID-1 storage with redundant power supplies 
  
Tdev solutions are characterized by the requirement for an external application host, a key differentiator relative to the [[Tmedia]] family of products.
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*[[TMS1600]]
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**A purpose-built switch designed to connect up to 16 TMP6400 devices in a single non-blocking system
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'''Compact PCI'''
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*[[TB640]]: TelcoBridges' VAS development platform based on CompactPCI blade hardware

Revision as of 11:29, 29 October 2009

Rear view of Tdev TMP6400 with support for 3 DS3 connections

Tdev is the trade name for TelcoBridges' family of computer telephony and value-added services (VAS) development platforms.

Tdev devices are targeted at service providers that are looking to introduce new value-added services in order to promote customer loyalty and/or increase ARPU. Applications developed with Tdev devices include unified communications, ringback tones, and pre-paid/post-paid calling services, among many others.

Tdev solutions are characterized by the requirement for an external application host, a key differentiator relative to the Tmedia family of products.


Individual products

The following products are part of the Tdev product line:


Rackmount

  • TMP800
    • Low density (8 full-duplex T1/E1/J1s) computer telephony platform; targeted to cost-effectively trial new value-added services
  • TMP5900
    • High density (64 full-duplex T1/E1/J1s, 3 DS-3, 1 STM-1) computer telephony platform with high performance onboard application host; available in 2U only; aimed at deploying new value-added services at the network core while simplifying OAM&P
  • TMP6400
    • High density (64 full-duplex T1/E1/J1s, 3 DS-3, 1 STM-1) computer telephony platform; available in 1U or 2U; providing a foundation for rapid subscriber uptake for new value-added services at larger points-of-presence (POP)
  • TMP7900
    • Very high capacity, high-availability computer telephony platform cluster; available configuration of up to 16 TMP-6400 units per rack for a total of 32,768 ports using a mix of E1/DS-3/STM-1 interfaces; aimed squarely at the network core, including large-scale value-added services or projects that involve device replacement and consolidation
  • TMP7950
    • 1U form factor TelcoBridges-branded server appliance featuring quad-core Intel Xeon processors and 2x500GB RAID-1 storage with redundant power supplies


  • TMS1600
    • A purpose-built switch designed to connect up to 16 TMP6400 devices in a single non-blocking system


Compact PCI

  • TB640: TelcoBridges' VAS development platform based on CompactPCI blade hardware
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